The Nasdaq 100 crossed 30,000 during intraday trading as semiconductor stocks surged, led by Micron Technology's 18% gain following a UBS analyst price target hike to $1,625. The rally was driven by increased AI spending expectations from hyperscalers, with chip stocks dominating market leadership. The S&P 500 rose 0.6%, while the Russell 2000 outperformed with a 1.7% gain. AutoZone plunged 10.1% after missing revenue estimates despite beating EPS.

As SpaceX prepares for a $2 trillion IPO, the semiconductor companies powering its technology are already publicly traded. The article highlights five chip stocks benefiting from SpaceX's infrastructure needs and the broader shift toward agentic AI, which is increasing CPU demand alongside GPU demand. Key beneficiaries include TSMC (manufacturing backbone), Intel (CPU demand surge), AMD (CPU and GPU exposure), NVIDIA (consolidating before next growth phase), and Amkor Technology (advanced packaging services).

Amkor Technology (NASDAQ: AMKR) reported strong Q1 2026 results, beating analyst expectations with EPS of 33 cents versus 22 cents consensus and revenue of $1.69 billion versus $1.65 billion estimate. The company also provided optimistic Q2 guidance of 42-52 cents EPS and $1.75-1.85 billion revenue, both above analyst expectations. Stock rose 0.94% to $76.30 in extended trading.

Tech and infrastructure stocks surged last week driven by AI and data center momentum. Applied Optoelectronics led with a 37.18% gain after securing a $71 million order for data center transceivers. Nebius jumped 33.92% on reports of acquiring AI21 Labs, while CoreWeave gained 25.63% following deals with Anthropic, Meta, and Google. Intel rose 22.42% after announcing its Terafab project participation.

The global high-end semiconductor packaging market is valued at USD 40.10 billion in 2025 and is expected to grow at a CAGR of 12.91% through 2035, reaching USD 134.90 billion. Growth is driven by increasing demand for AI processors, high-performance computing, data centers, and advanced consumer electronics. Asia-Pacific dominates with 68.4% market share, while flip-chip packaging leads by type at 32% market share.

Amkor Technology (AMKR) hit a 52-week high after reporting strong Q4 earnings that beat expectations, with EPS of 69 cents versus 44 cents consensus and revenue of $1.89 billion versus $1.84 billion estimate. The company guided FY26 revenue growth of 11% and FY27 growth of 16%, supported by cyclical recovery and advanced packaging ramp. Needham analyst Charles Shi maintained a Buy rating and raised the price target from $50 to $65.

Amkor Technology (NASDAQ: AMKR) reported strong Q4 earnings of 69 cents per share, beating consensus estimates by 56.11%, with quarterly revenue of $1.89 billion exceeding Street estimates. The company expects Q1 GAAP EPS of 18-28 cents and revenue of $1.6-1.7 billion. Stock rose 3.01% to $54.10 in extended trading.

The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025 and is projected to grow at a CAGR of 22.99% through 2033, reaching USD 2.47 billion. Growth is driven by increasing demand for advanced semiconductor packaging to support AI, high-performance computing, 5G, and defense applications. However, manufacturing complexity, skill gaps, and scaling challenges may hinder growth. 3D integration and Through-Silicon Via (TSV) technologies are leading segments, with Asia Pacific dominating at 48.38% market share.

U.S. stock markets declined on Wednesday as technology and financial sectors weakened amid uncertainty over a Supreme Court ruling on Trump's tariffs. The Nasdaq 100 fell over 1.5%, led by semiconductor losses. However, the energy sector surged over 2.4% as crude oil climbed toward a sixth consecutive day of gains. Commodities like gold and silver also rallied, while Bitcoin rose to $97,000.

The global advanced packaging market is expected to grow from USD 40.34 billion in 2025 to USD 78.75 billion by 2034, driven by rising demand for high-performance computing, AI, 5G devices, and compact electronics, with North America leading technological advancements.

The global semiconductor and IC packaging materials market is expected to grow from $53.48 billion in 2026 to $114.28 billion by 2034, driven by increasing demand for advanced electronics, 5G, AI, and IoT technologies, with significant government investments supporting domestic semiconductor manufacturing.

The global organic substrate packaging materials market is expected to grow from $17.40 billion in 2025 to $28.41 billion by 2034, driven by demand for miniaturized electronics, semiconductor packaging, and 5G technologies, with Asia-Pacific leading market expansion.